Fully Automatic Dicing Machine for Maximum Precision and Efficiency in Wafer Processing
Streamline your production with the AD3000T-PLUS – a compact and powerful solution for high-precision, automated wafer dicing.
The AD3000T-PLUS is an advanced, fully automatic dicing machine designed specifically for wafers up to 300 mm in diameter. Its innovative diagonal spindle layout not only saves valuable floor space but also offers exceptional serviceability. The machine is designed for front-only access, making it ideal for clean and compact production environments.
The AD3000T-PLUS with Innovative Dual-Spindle Configuration
The AD3000T-PLUS features a unique dual-spindle setup with a diagonal layout that reduces processing times and maximizes overall productivity. Equipped with servo motors on the X, Y, and Z axes, the system enables rapid, precise movement. Achieving speeds of 1,000 mm/s (X-axis), 300 mm/s (Y-axis), and 80 mm/s (Z-axis), it delivers outstanding performance without sacrificing precision.
Precision Cutting from Silicon to Hard-to-Process Materials
With a high-performance spindle motor delivering up to 60,000 rpm and 1.8 kW of power, the AD3000T-PLUS handles a wide range of materials – from standard silicon to challenging substrates. For particularly demanding materials, an optional 2.2 kW spindle with higher torque can be installed, enabling fast and accurate cutting of complex structures.
User-Friendly Interface and Easy Operation
A 17-inch touchscreen and intuitive graphical user interface (GUI) make operating the AD3000T-PLUS straightforward. All major functions can be controlled easily through the interactive panel.
Automated Blade Replacement with Integrated ABES
A standout feature of the AD3000T-PLUS is the option to integrate the Auto Blade Exchange System (ABES), which automatically detects blade wear and performs full blade replacement with no manual intervention.
Energy-Efficient Design with Eco Mode for Reduced Air and CO₂ Consumption
The integrated Echo function significantly reduces air consumption—cutting energy usage by over 50% compared to conventional systems. This results in lower operating costs and minimized environmental impact through reduced CO₂ emissions.
Optional Add-ons
- Built-in UV irradiation system
- Barcode reader for automatic recipe switching
- Ionizer function to enhance the production environment
Technical Specifications – AD3000T-PLUS
- Max Workpiece Size: Φ305 mm
- Spindle Speed: Up to 60,000 rpm
- Max Cutting Speed: X-axis: 1,000 mm/s, Y-axis: 300 mm/s, Z-axis: 80 mm/s
- Repeatability: 0.001 mm
- Auto Blade Exchange (ABES): Optional
- Power Consumption: Max. 6.0 kVA
- Dimensions (W x D x H): 1,290 mm × 1,530 mm × 1,900 mm
- Air Consumption: 210 L/min (at 0.55 MPa)
- Exhaust Volume: ≥ 5.0 m³/min
Increase your production capacity and automation with the AD3000T-PLUS!
Find the right blades for you:
Ensure maximum performance, precision and process reliability – precisely tailored to your application.
Resin Bond Dicing Blade for glass and ceramics →
Resin Bond Dicing Blade for QFN and DFN packages →
Metal Bond Dicing Blade for glass and quartz →
Metal Bond Dicing Blade for modern electronics processing →
Metal Bond Dicing Blade for high-performance ceramics →
Ultra-hard Metal Dicing Blade for non-ferrous metals →
Hub Dicing Blade for silicium →
Nickel Bond Dicing Blade for wafer and substrates →
Nickel Bond Dicing Blade for ceramics →
Nickel Bond Dicing Blade for raw ceramics and hard materials →
Maximum performance with the right machine accessories:
Find efficient water treatment and cleaning solutions for your dicer process.
WR30X PLUS: Efficient Water Treatment for Wafer Dicing →
TD2A-3S / TD1A-S: CO₂ Add-On System for Wafer Dicing →
P102E: Additive Dispensing system for Wafer Dicing →
P103: Additive Dispensing with Diaphragm Pump Technology for Wafer Dicing →
A-CS-300: Automatic Cleaning System for Wafer Dicing →
